Press Releases

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OMMIC launches a new family of Double Balanced Wide Band Mixers - march. 2007
OMMIC launches Attenuator and Phase Shifters for C-Band - sept. 2006
OMMIC launches a new High Gain, Low Noise Amplifier for C-Band - march. 2006
OMMIC launches a new range of products including phase shifters, attenuators and complete integrated core chips - oct. 2005
OMMIC launches a new Low Noise Amplifier for Base Stations - oct. 2005
OMMIC launches a new Centre of Excellence in Belfast - oct. 2005
OMMIC announces the release of a new product for its defence and Instrumentation Product Line - oct. 2004
OMMIC announces the release of 2 new products to its 10Gb/s Fibre Optic Interface Product Line - oct. 2004
Alcatel transfers advanced Indium Phosphide (InP) technology to OMMIC for development of new Microelectronic circuits - dec. 2003
Double Success for OMMIC in ISO9001/ISO14001 Accreditation - march. 2003
OMMIC Launches a 10 Gb/s TIA with exceptional dynamic range - march. 2003
AWR and OMMIC announce support for GaAs foundry Process - sept. 2002
OMMIC 43 Gb/s ChipSet - march 2002
OMMIC announces the availability of a 150 GHz MHEMT process - sept. 2001
New GaAs Device Company formed - jan. 2000

 

OMMIC launches a new family of Double Balanced Wide Band Mixers - march. 2007
RF & Hyper Europe 2007, 27-29 March 2007, CNIT la Défense, Paris, FRANCE

Paris, 27th March 2007

RF & Hyper 2007, la Défense, Paris, 27th March 2007 - OMMIC announces the introduction of a new family of high performance Wide Band Double Balanced Mixers covering the band 0.7 GHz to 10 GHz. These MMICs are ideal for use in GPS, Telecommunication, Radar, EW and Instrumentation applications.

The CGY2180UH, CGY2181UH, CGY2182UH use on chip baluns to provide excellent rejection of the LO to the RF and IF paths of > 40 dB while the passive mixer structure gives a very high dynamic range with an Input 1 dB Compression Point of > 12 dBm. The CGY2180UH was designed to operate from 0.7 GHz to 3.7 GHz and is ideal for GPS applications such as the European Galileo System. The CGY2181UH operates from 1 GHz to 4.5 GHz and the CGY2182UH from 3 GHz to 10 GHz.

These die are manufactured using OMMIC's 0.18 µm gate length PHEMT Technology. The MMIC uses gold bonding pads and backside metallization and is fully protected with Silicon Nitride passivation to obtain the highest level of reliability.

Samples and demonstration boards are available from stock.

These MMICs have been developed in the framework of the European Space Agency's "European Component Initiative" with the participation of Alcatel Alenia Space.

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OMMIC launches Attenuator and Phase Shifters for C-Band - sept. 2006
European Microwave Week 2006, 12-14 September 2006, GMEX / MICC, Manchester, UK

Manchester, 12th September 2006

European Microwave Week, Manchester, UK, 12th September 2006 - OMMIC announces the introduction of 2 new circuits in its family of products of Control Functions for Military, Civil and Telecommunication Applications.

The CGY2176AUH is a 6-bit Digital Attenuator with excellent performance from 4.5 - 6.5 GHz. Typical Insertion Loss is 5 dB at 5 GHz. Robust on-chip circuitry provides easy to use CMOS compatible interfacing with low power consumption.

The CGY2177AUH is a 6-bit Digital Phase Shifter with excellent performance from 4.5 - 6.5 GHz. Typical Insertion Loss is 5 dB at 5.5 GHz. Robust on-chip circuitry provides easy to use CMOS compatible interfacing with low power consumption.

Using OMMIC's unique 0.18 µm E/D Mode PHEMT technology allows the design of smart interfacing that is robust and low power consumption. This technology is used for higher volume commercial LNA production as well as Military and Space Payload applications.

These devices are part of OMMIC's chip set for active antennas in C-band and X-Band that include fully integrated core chip MMICs as well as separate phase shifters, attenuators and Amplifier MMICs.

Samples and demonstration boards are available.

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OMMIC launches a new High Gain, Low Noise Amplifier for C-Band - march. 2006
RF & Hyper Europe 2006, 21-23 March 2006, CNIT la Défense, Paris, FRANCE

Paris, 21st March 2006

RF & HYPER, la Défense, Paris, 21st March 2006 - OMMIC announces the introduction of the CGY2178UH a Low Noise - very High Gain Amplifier for use in C-Band applications (5 - 6 GHz).

The CGY2178UH achieves an excellent noise figure (1 dB), matching (<-15 dB) and a high gain (30 dB) in C-Band using a fully integrated amplifier with a simple and robust external input matching circuit. Operating from 3 V and 40 mA the CGY2178UH provides an output 1dB compression point of 15 dBm and an output IP3 of 22 dBm.

Based on its experience in supplying ultimate performance LNAs to the Base Station Market using a fully qualified 180 nm PHEMT technology and its recent developments in Phased Array Antenna MMICs, OMMIC has been able to design a robust and high performance LNA perfectly suited to C-Band applications.

This LNA forms part of OMMIC's chip set for active antennas in C-band that includes a fully integrated core chip MMIC as well as separate phase shifters and attenuators MMICs.

Samples and demonstration boards are available.

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OMMIC launches a new range of products including phase shifters, attenuators and complete integrated core chips - oct. 2005
European Microwave Week 2005, 4-6 October 2005, CNIT la Défense, Paris, FRANCE

Paris, 3rd October 2005

European Microwave Week, la Défense, Paris, 3rd October 2005 - OMMIC announces the introduction of a new range of products to its catalogue. These include 6-bit phase shifters, 6-bit attenuators and complete integrated core chips at X-band and C-band.

The new range of products takes advantage of OMMIC's unique 0.18 mm enhancement-depletion process which allows the complete integration of functions including phase shifters, attenuators, switches, amplifiers and also include on-chip low power consumption digital circuitry such as a series to parallel data converter. This allows complex functions to be designed that have very simple interfacing.

First products include the CGY2170UH and CGY2175UH which are fully integrated "Core Chip" functions for Phase Array Radar at X-band and C-band respectively. Both circuits are controlled via a series data bus (data, clock, enable) with on chip series-in parallel-out (SIPO) conversion to control the 6-bit phase shifters, 6-bit attenuators and T/R switches. The CGY2170UH is available for sampling.

Separate attenuators and phase shifters, with and without control circuits, are also in development for X-band and C-band applications. The CGY2171UH and CGY2172UH, X-band attenuator and phase shifter respectively, are available for sampling.

Marc Rocchi, OMMIC's CEO, comments "this is natural extension of OMMICs product catalogue to an area where we have worked for many years with our partners and customers. We see a great demand for these products not only from the space and military but also for commercial products in the future."

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OMMIC launches a new Low Noise Amplifier for Base Stations - oct. 2005
European Microwave Week 2005, 4-6 October 2005, CNIT la Défense, Paris, FRANCE

Paris, 3rd October 2005

European Microwave Week, la Défense, Paris, 3rd October 2005 - OMMIC announces the introduction of the CGY2109HV a very Low Noise - very High Linearity amplifier for Base Stations. This product further extends OMMIC's LNAs for base stations and is suitable for all GSM, DCS, PCS and W-CDMA applications.

The CGY2109UH achieves an excellent noise figure and gain from 100 MHz to 3 GHz while simultaneously providing a high IP3. This device is a dual LNA, with 2 amplifiers fabricated on the same die, with outstanding tracking between the two circuits. The plastic packaged (QFN) dual LNA is delivered as fully RF tested product.

At 1.9 GHz the demonstration board has a gain of 19 dB, 0.5 dB noise figure and an input IP3 of 11 dBm. Used in a balanced configuration, the CGY2109UH will allow a complete amplifier noise figure (including all connector, coupler and matching losses) of 0.6 dB and an output IP3 of 33 dBm with input and output matching better than - 25 dB.

Samples and demonstration boards are available.

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OMMIC launches a new Centre of Excellence in Belfast - oct. 2005
European Microwave Week 2005, 4-6 October 2005, CNIT la Défense, Paris, FRANCE

Paris, 3rd October 2005

European Microwave Week, la Défense, Paris, 3rd October 2005 - OMMIC announces the signing of a MoU (Memorandum of Understanding) with Queen's University of Belfast High Frequency Electronics Research Group (HFE), who will act as an OMMIC European Centre of Excellence for MMIC Research and Design.

The purpose of these Centres of Excellence is to jointly extend the development capacity of the Industrial and University Communities by enhancing the interface between Research, Design, Fabrication and Measurement.

Professor Vincent Fusco, Director of High Frequency Research said "this agreement represents a significant development which will permit joint opportunities for innovation in key areas of advanced microwave telecommunication technology and will grant access to OMMIC's most advanced processes."

Derek Smith, OMMIC Marketing and Sales Director comments "Queen's HFE Group has a significant research, design and prototyping resource and has already demonstrated its ability to successfully design MMIC products using OMMIC's processes. This collaboration will improve time to market, provide additional support for customers and enhance our joint research efforts."

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OMMIC announces the release of a new product for its defence and Instrumentation Product Line - oct. 2004

Amsterdam, 11th October 2004

EuMW04, Amsterdam, 11th October 2004 - OMMIC adds a new ultra wideband amplifier to its product portfolio. This device is based on OMMIC's extensive knowledge on low noise and driver amplifiers for 40 Gb/s optical transmission systems and provides an excellent noise figure and compression point up to 45 GHz.

The CGY2160UH has a bandwidth of 1.5 to 45 GHz and provides a high gain of 15 dB. This MMIC has an excellent mid-band noise figure of 2.5 dB and delivers 18 dBm of P1dBm at 20 GHz and 15 dBm at 40 GHz. The power consumption is only 500 mW and requires no external biasing networks. Good input and output matching to 50 W is achieved and unconditional stability is guaranteed over the entire frequency, biasing and temperature range.

Typical applications for this product are Electronic Warfare systems, Radar and Counter Measures, Instrumentation and as a general purpose wide band gain block.

The CGY2160UH is fabricated using OMMIC's standard 130 nm power PHEMT Space Qualified process. Samples and datasheets are available.

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OMMIC announces the release of 2 new products to its 10Gb/s Fibre Optic Interface Product Line - oct. 2004

Amsterdam, 11th October 2004

EuMW04, Amsterdam, 11th October 2004, OMMIC announces the introduction of 2 new products to its family of optical interfacing circuits working up to 10.7 Gb/s. These products offer improved overall performance and are well suited to the ever more demanding specifications required by 10 Gb/s optical systems.

The CGY2115 is available as a bare die (CGY2115UH) or in a small profile QFN16 plastic package (CGY2115HV) and is designed to drive an electro-absorption modulator (EAM) at speeds up to 10.7 Gb/s. The bare die version has a rise time of 19 ps and a fall time of 14 ps while the packaged device has excellent rise time and fall times of 27 ps and 24 ps respectively. The devices have on chip biasing networks, voltage offset controls and cross-point controls to enable easy interfacing to the EAM. The circuit operates from a single - 5.2 V supply and delivers up to 3 Vpp voltage swing and a 1 V bias offset to the EAM.

The CGY2116UH is a very high performance Transimpedance Amplifier (TIA) for 10.7 Gb/s and completes OMMIC's family of interface products for fibre optic communications. It combines an exceptional sensitivity of - 22 dBm with on chip AGC to provide a high input overload of > 2.5 mA. This new product has a bandwidth of 9.5 GHz, a high differential transimpedance gain of 74 dBW and a group delay of less than ±25 ps up to 10GHz. The power consumption is typically 400 mW from a single + 5 V supply.

Both devices are fabricated using OMMIC's space qualified 180 nm Enhancement-Depletion Mode PHEMT technology. Samples and datasheets available on request.

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Alcatel transfers advanced Indium Phosphide (InP) technology to OMMIC for development of new Microelectronic circuits - dec. 2003

Paris, 1st December 2003

Alcatel (Paris: CGEP.PA and NYSE: ALA) and OMMIC announced today that they are collaborating on the transfer of Alcatel's advanced Indium Phosphide (InP) Heterojunction Bipolar Transistor (HBT) technology to OMMIC's Industrial Clean Rooms at its centre in Limeil-Brévannes, France. This transfer will complete OMMIC's commercial portfolio of III-V technologies and will provide Alcatel's System designers with a qualified source to develop 40 Gbit/s transmission systems for core networks.

InP, now well established as the choice material for long wavelength (1.3 -1.6 µm) optoelectronic devices, is receiving an increasing interest for its potential in microelectronic applications, ranging from millimetre-wave space and terrestrial communication systems, to very high bit rate fibre transmission systems (e.g. 10 and 40 Gbit/s).

The InP HBT technology was developed by the Alcatel Research & Innovation Department in the framework of its studies into 40 Gb/s transmission. On top of the normal advantages of the conventional bipolar transistor (high current drive capability, very low threshold voltage dispersion…), this InP DHBT process (actually a Double Heterojunction Bipolar structure is used) offers an exceptionally high cut-off frequency (greater than 200 GHz) with a breakdown voltage higher than 5 V. Using this DHBT technology, Alcatel has already developed prototype chip sets at 40 Gbit/s that have shown excellent results including record breaking performances. These circuits include full rate D-type Flip-Flops for reshaping or decision circuits, multiplexer-drivers as well as Voltage Controlled Oscillators.

OMMIC, already known for its unique enhancement-depletion mode and high frequency power PHEMT and MHEMT technologies, will now be one of the first foundries in the world to be able to offers its customers access to a leading edge InP HBT process.

Marc Rocchi, COO and CTO of OMMIC commented "We are delighted that we are going to be able to offer to our customers this outstanding technology developed by Alcatel. OMMIC has based its business on being able to provide technologies with real advantages compared to our competitors. This new InP DHBT process fits in exactly with our strategy and technology roadmap and will maintain OMMIC's leadership in III-V processes."

Joëlle Gauthier, Vice-President of Alcatel Research & Innovation, declared that "To prepare the future deployment of 40 Gbit/s systems, Alcatel has to secure the industrial availability of all required technologies, and we feel InP DHBT is one of them. This is why OMMIC commitment to develop the InP DHBT process is very good news for us."

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Double Success for OMMIC in ISO9001/ISO14001 Accreditation - march. 2003

Paris, 31st March 2003

OMMIC has obtained the ISO 9001 version 2000 Certification for the Design and Manufacturing operations of its III-V MMIC foundry as well as OMMIC's Epitaxial Wafer production facility. This certification covers the newest version of the ISO9001 standard that has adopted a process approach to quality management which puts the customer and continual improvement at the heart of the quality system.

OMMIC had already gained the ISO14001 environmental management certification in May 2002 for its manufacturing clean rooms and support facilities. The ISO14001 certification demonstrates OMMIC's commitment to an environmentally friendly culture and "green' manufacturing.

Marc Rocchi, OMMIC's Chief Operating Officer, commented "This double success is a sign of OMMIC's commitment to the highest quality level of its products, the satisfaction of its staff, customers and local community. It has helped OMMIC to improve its efficiency and profitability while maintaining our objective of long term and sustainable growth. The ISO accreditations are globally recognized standards that have been achieved due to the tremendous effort and teamwork from the OMMIC Personnel enabling us to have been certified for both ISO9001 and ISO14001 in less than 12 months."

OMMIC, which is part of the Philips Group of Companies, is a leading supplier of MMIC circuits, Foundry Service and Epitaxial Wafers based on III-V materials. The main markets for the foundry and standard product line are Telecommunication Applications such as Base Stations, Fibre Optic Links and Satellite Payloads. The Epitaxial unit produces high volume 4" and 6" wafers for PHEMT and HBT Foundries.

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OMMIC Launches a 10 Gb/s TIA with exceptional dynamic range - march. 2003

Paris, 24th March 2003

OMMIC announced today at the OFC conference in Atlanta, USA that it has released the latest addition to its chipset for Fibre Optic Interfaces, a 10 Gb/s Transimpedance Amplifier (TIA) called the CGY2112 which combines excellent sensitivity and high optical overload.

The CGY2112 has the double advantage of an excellent sensitivity of typically - 21 dBm with a PIN Photodiode, with better than 2.5 mApp of overload capability. The on chip Automatic Gain Control and final stage limiting function provide a clean eye diagram up to the optical overload.

The TIA has differential outputs and provides 72 dBO of differential gain and a bandwidth of typically 9.5 GHz. The CGY2112 uses a single +5 V supply and only 70 mA of current. All devices are 100 % tested on wafer.

The CGY2112 is fabricated using OMMIC's state of the art and unique dual-mode PHEMT 0.18 µm MMIC process.

Derek Smith, OMMIC's IC Marketing and Sales Manager, commented "This new device combines OMMIC's technological lead in device technology with a sound skill in advanced circuit design. Our objective is to give our customers the circuits that will enable them to build their modules with a real performance advantage. Results from Key Customers who had access to pre-release samples have confirmed the benefits of the CGY2112 in terms of sensitivity and overload."

Applications for the CGY2112 include use in Fibre Optic Modules (MSA300, XENPAK, XPAK, X2, XFP) for Short Reach, Metro, Long-Haul and Ultra Long Haul optical receivers.

OMMIC, which is part of the Philips Group of Companies, is a leading supplier of MMIC circuits, Foundry Service and Epitaxial Wafers based on III-V materials. The main markets for the foundry and standard product line are Telecommunication Applications such as Base Stations, Fibre Optic Links and Satellite Payloads. The Epitaxial unit produces high volume 4" and 6" wafers for PHEMT and HBT Foundries.

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AWR and OMMIC announce support for GaAs foundry Process - sept. 2002

European Microwave Conference, MILAN, Italy - September 24, 2002

Applied Wave Research, Inc. (AWR), a leading supplier of high-frequency electronic design automation (EDA) tools, and OMMIC, formerly Philips Microwave Limeil (PML), today announced plans to provide process design kit (PDK) library support for OMMIC's gallium arsenide (GaAs) foundry process. Monolithic microwave integrated circuit (MMIC) designers will use the libraries, within AWR's Microwave Officeä 2002 environment, to speed the design of high-end wireless and fibre optic infrastructures while helping to ensure electrical specifications are met.

OMMIC is a member of the Philips group of companies and is working on the leading-edge research, design, and manufacture of GaAs semiconductor devices using integrated circuit (IC) and epitaxy technologies. "OMMIC is committed to supporting state-of-the-art MMIC design tools and, over the past four years, AWR has clearly established itself as a leader within the GaAs MMIC market," said Remy Leblanc, OMMIC foundry manager. "By working with AWR to integrate GaAs process technology into the Microwave Office design flow, we can offer MMIC designers a premier EDA tool for OMMIC technology-based product development."

"We have a rapidly increasing number of customers requesting support for the OMMIC GaAs foundry processes," said Ted Miracco, AWRä executive vice president. "We are therefore very pleased to be working with the OMMIC team in Paris to bring this technology to our joint customers. This collaboration supports our vision for streamlining the MMIC design process with improved productivity through increased accuracy and integration.

" The PDKs will include validated electrical models and parameterized layout cells that have been tested and validated against OMMIC's design rules. "The quality of the EDA package, such as AWR's Microwave Office design suite, and the quality of the OMMIC developed libraries, becomes increasingly more important with the introduction of higher-performance processes and the need for a "right-first-time" design," continued Leblanc.

OMMIC has a long history of working as an open foundry. The company's first external customers were using the foundry service in 1986. Since then, OMMIC has introduced Psuedomorphic High Electron Mobility Transistor (PHEMT) technologies and now, advanced high indium content, indium phosphide (InP)-like Metamorphic High Electron Mobility Transistor (MHEMT), while gate lengths have been reduced from 0.7 µm to 0.13 µm in production, with research at 0.07 µm. Access to these technologies is now available through complete mask sets or shared runs.

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OMMIC 43 Gb/s ChipSet - march 2002

Paris, 25th March 2002

OMMIC announces the launch of 2 high performance MMICs for the Fibre Optic Interface market operating at data rates of 43 Gb/s. The CGY2144 is a high sensitivity TIA (Transimpedance Amplifier) and the CGY2141 a high output voltage driver amplifier. Both devices operate from a +5 V supply and are manufactured using OMMIC's fully released 0.13 µm PHEMT process.

The CGY2141 driver IC has a small signal gain of 16dB and a 3 dB bandwidth of 50 GHz. At 30 GHz and with an input voltage of 1 V the CGY2141 provides 5 V on a 50 Ohms load and over 7 V with an input voltage of 2 V. The device is designed for high efficiency and consumes only 900 mW with 5 V supply so minimising thermal dissipation and current consumption.

The CGY2144 Transimpedance Amplifier is a very wide-band, very high sensitivity device that runs from a single + 5 V supply with on chip biasing networks that make this TIA very easy to use. A bandwidth of over 45 GHz (assuming a photodiode with 50 fF of capacitance and 0.35 nH of Inductance) and 48 dBOhms of Transimpedance gain is achieved. The measured noise performance is better than 10 pA/vHz up to 25 GHz. This MMIC completes OMMIC's range of very high sensitivity TIAs for data rates at 2.5 Gb/s, 10 Gb/s and 40 Gb/s.

Both MMICs are available as RF Characterised Known Good Die (KGD). They form part of OMMIC's chip set for 43 Gb/s applications and have been developed using OMMIC's fully released and mature 0.13 µm PHEMT technology.

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OMMIC announces the availability of a 150 GHz MHEMT process - sept. 2001
European Microwave Week 2001 24-28 September 2001

Paris, 21stb September 2001

OMMIC announces that it will be making available to the open market its recently developed Metamorphic HEMT process (MHEMT) as from October 2001. This process is ideally suited to the market of advanced devices for the Opto-Electronic market at data rates of 40 Gb/s and above where there is a need for technologies with a high Ft associated with a high breakdown voltage.

The MHEMT technology builds on OMMICs already successful PHEMT technologies and opens the path to exceptional performance using standard GaAs wafers and advanced Epitaxial Growth techniques.

OMMIC's MHEMT technology enables a Ft of 150 GHz to be obtained simultaneously with a breakdown voltage of 10V. The technology has all the standard options of a MMIC process including small size back side Via Holes for low Inductance grounding. This process can also be associated with OMMIC's state of the art Bump process, a key element in simplifying packaging particular at higher date rates.

The MHEMT process uses a 0.13 µm mushroom gate which is placed asymmetrically in the Drain-Source spacing. This combined with the double recess of the channel and optimised epitaxial layers gives this process the high breakdown voltage without compromising the Ft. The use of an optimised, high Indium content channel with graded buffer layers allows OMMIC to have the high Ft of high Indium content processes (such as InP) but to use conventional GaAs wafers as a substrate. This gives the MHEMT process the advantage of being compatible with standard GaAs processing and so is upgradeable to 6 inch wafers and beyond. The GaAs substrate allows easy backside processing and low wafer breakage.

OMMIC will be offering this advanced technology to selected partners in 2001 through its MultiChip Project scheme or via full customer mask sets. OMMIC has been a provider of foundry services to the external market since the mid-1980's and has built up a strong support team and knowledge of this business.

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New GaAs Device Company formed - jan. 2000

GaAsNet : OMMIC is new operating name of a new company formed from Philips Microwave Limeil (PML) 16 March 2000

A new company and a major force in GaAs semiconductor technology has been created from Philips Microwave Limeil (PML).
Named OMMIC, the new company will build on PML’s lead position in the research, development and manufacture of GaAs semiconductor devices.

The management of OMMIC announced the operating name of a new company formed from Philips Microwave Limeil (PML).OMMIC will build upon the worldwide recognition of the former PMI leading-edge work in research, design and manufacture of GaAs semiconductor devices using IC and epitaxy technologies.
As OMMIC, the new company becomes self-reliant with enhanced flexibility to fulfil its plans in expanding further in specialized applications, primarily with high-frequency devices and systems for the telecoms market. OMMIC, a wholly-owned Philips company, will continue to have its headquarters in Limeil-Brevannes on the outskirts of Paris.

In addition to capitalizing on the comprehensive portfolio of products and services produced by PML, OMMIC intends to expand its competencies in both foundry-produced MMICs and devices manufactured through MOVPE reactor methods.
OMMIC also inherits the pioneering development work of PML in building the world’s first planetary epitaxial reactor - licensed for manufacture to the Aachen, Germany, based company Aixtron. In this field, OMMIC has more than 15 years proven experience in the growth of pHEMTs using MOVPE. In addition to the planetary reactor, OMMIC holds more than 100 patents in GaAs production technologies and processes. OMMIC’s current product portfolio primarily comprises GaAs integrated circuits like pHEMT low-noise amplifiers used in high-end wireless and fibre optic infrastructures.
The company also offers a comprehensive service in foundry and epitaxy processes. Technology, development and production roadmaps are in place for a range of innovative new products which will fulfil the stringent demands of the telecoms and related markets for the next five years.

Review of Elsevier’s III-Vs Review magazine May-June 2000 issue – Vol. 13 No. 3

Philips Microwave Limeil (France) has formed a new wholly-owned Philips company called OMMIC to do foundry-produced MMICs and MOCVD-manufactured devices such as pHEMT low noice amps for high end wireless and fibreoptic infrastructures, and foundry and epitaxy services.
OMMIC inherits over 100 GaAs production and processing patents which includes the license to Aixtron for the Planetary reactor. Expansion will involve acquiring additional reactors. OMMIC tel: 33-1-45-10-6922

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