CGY2112UH/C1

 

10.7Gb/s Linear TransImpedance Amplifier

 

 

Package Function Data Rate(Gb/s) Diff gain(dBΩ) Input overload (mApp)

On Chip AGC

Out Current(mA) Power Supply(V) Status Process
DIE Differential Output TIA 10 72 2.5 Yes Diff 70 +5 Available ED02AH

 

Description

The CGY2112UH is a 10.7 Gb/s TransImpedance Amplifier (TIA), designed for use in optical reception systems.

The device is intended to be used with a PIN or APD photodetector. There is a built in AGC function which limits the peak-to-peak output voltage and protects the device from optical input overload.

The die is manufactured using OMMIC’s 0.18 μm gate length PHEMT Technology. The MMIC uses gold bonding pads and backside metallization and is fully protected with Silicon Nitride passivation to obtain the highest level of reliability. This technology has been evaluated for Space applications and is on the European Preferred Parts List of the European Space Agency.

 

 

Applications

  • 10 Gbps optical receivers
  • DWDM SONET/SDH
  • Transponders modules : MSA300, XENPAK, XPAK, X2
  • Transceivers modules : XFP

 

 

 

 

 

 

 

Features                                                

  • Suitable for 10.7 Gb/s optical fiber links
  • Single +5 V supply voltage
  • 2 KW (66 dBW) single-ended transimpedance
  • Sensitivity : -21 dBm
  • Built in AGC function
  • 85 mA consumption current at +5 V
  • 425 mW Power consumption at +5 V
  • Tested, Inspected Known Good Die (KGD)
  • Samples Available
  • Demonstration Boards Available
  • Space and MIL-STD Available

 

Block Diagram of the CGY2112UH/C1

Datasheet

Application Note