Our wafers are delivered with electrical properties guaranteed by the measurement of specific test modules added during the fabrication called Process Control Monitor (PCM). Our processes and our equipment are also monitored with Statistical Process Control (SPC).
In addition to wafer manufacturing, OMMIC provides back-end services to provide only known good dies (KGD).
OMMIC runs automatic On-Wafer test benches to provide only know good dies. The testing is performed in a controlled clean room and follows the customer’s requirements.
All usual tests are available (i.e. S-parameters, spectrum analysis, Scalar measurements, Noise Figure, DC pulsed power measurements, etc). This adds up to our DC & RF front end process monitoring. OMMIC opens its RF-test capabilities and knowledge to design and conduct tests on customers prototype to help them improve their products.
Once produced, the wafers can be shipped in Boxes, on film, or picked. If the wafer has been tested, OMMIC will discriminate the good and bad electrical dies. Mass production volumes can be very important, especially on 6-inch. This is why OMMIC has been investing in automated tool such as our automatic picking machine to fully support 5G volumes.The picked dies can be packed in Gel-Pack® or waffle pack.
OMMIC performs visual inspection at each critical steps during the manufacturing process to ensure anomaly detections. In addition to those tests, OMMIC can perform visual inspection at the end of the process to unsure further anomaly detections. Space (MIL-STD-883) and commercial screening are available.
In today’s world, integration and ease-of-use are critical to complex electronic subsystems. This is why OMMIC invests every day in simplifying the use of its producs while maintaining high performances. Our solutions covers L-, S-, C-, X- and K-band. We are now focussing on packaging medium power GaN power amplifiers with cost-efficient techniques.