CUSTOM DESIGN

CUTTING EDGE CUSTOM PRODUCTS AS A BREEZE

OMMIC provides custom design MMIC services based on customer’s specifications and statement of work, from DC to W-band.

  • Low Noise Amplifiers
  • Power Amplifiers
  • T/R chips (PA, LNA and Switches integrated)
  • Digital controlled functions (Phase, Gain, TTD, etc.)
  • Multipliers
  • Converters
  • Transimpedance Amplifiers

EXAMPLE OF OMMIC’S IN-HOUSE DESIGN

Outuput Power

OW pulsed vs. PCB CW

State of the Art Power Added Efficiency

CUSTOM DESIGN STEPS

OMMIC’s design flow includes several reviews where in-depth discussions are held with the customer to ensure the designed MMIC really enhances the final system. This design flow is based on space standards such as ECSS-Q60-12A and have been approved for flight models designs. The fabrication line, test center, reliability center and modeling team are on the same site. This proximity allows OMMIC design center to obtain the best performances from all the OMMIC processes, while maintaining yield and reliability.

 

A simplified version of this flow is presented here bellow (hover for additional details) :

STEP 1 : SPECIFICATION

Non-Disclosure Agreement (NDA) is signed to ensure confidentiality


Project frame and specification are discussed with OMMIC’s team

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STEP 2 : PDR

Preliminary Design Review (PDR) is presented to the customer


The device size and specs can be estimated

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STEP 3 : CDR

Critical Design Review (CDR) is presented to the customer


The device size and specs can be reviewed

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STEP 4 : FAB

The wafer is manufactured in our factory (Fab)

Process Control Monitoring cells are used to control the wafer’s quality

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STEP 5 : RELIABILITY

If needed, reliability testing can be done for flight models


For space qualified processes only WAT and LAT are needed

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STEP 6 :
BACK-END

Visual Inspection is performed


On-Wafer test is performed following the test plan

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