CGY2770UH/C2

11-11.5 GHz x8 MULTIPLIER

The die is manufactured using OMMIC’s Advanced 130 nm gate length medium Indium content mHEMT technology (D01MH). The MMIC uses gold bonding pads and backside metallization and is fully protected with Silicon Nitride passivation to obtain the highest level of reliability.

PRODUCT DSDatasheet / S2PS2P Files / QTGet a quote FREQ. MIN (GHz) FREQ. MAX (GHz) MULTIPLICATION ISOLATION (dB) OUTPUT POWER (dBm) PACKAGE BOARD STATUS PROCESS
CGY2770UH/C2
11 11.5 x8 20 5 Die - Production D01MH

FEATURES

  • Product size: 3.45 x 2.25 mm²

APPLICATIONS

  • Radar
  • Telecommunication
  • Instrumentation
  • Passive and Active Radar Imaging

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MULTIPLIERS

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EXOTIC SPECS?

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