Space grade processes for everyone. This is the promise OMMIC offers by providing its products designed with processes approved for space use
We have a dedicated reliability team to carry out our industrialization process but also, to do the necessary screening in order to ship flight models. We have been supplying standard parts designed by OMMIC or during the European Component Imitative (ECI) program. To this day, it represents more than 50 000 MMICs for flight models, with an accumulated life time over 1 000 000 years.
Our MMICs are orbiting around the earth in several space missions and satellite equipment from Europe, United States, China, Japan and other countries.
Each of our products has been designed with processes approved by the European Space Agency (ESA). We follow the design guidelines and requirements provided by ESA with whom we have been working in close collaboration for over 20 years.
Currently, three of our processes (ED02AH, D01PH, D01MH) are qualified and included in ESA’s European Preferred Part List (EPPL). And after successful space pre-evaluations campaigns, two additional processes are considered to be inserted in the EPPL within the next few months (D007IH, D01GH).
Today, 70 % of our standard products have been designed using ESA’s EPPL processes. But we won’t stop there, we plan to increase this figure to 98 % by 2022. Do not hesitate contacting us for your most ambitious projects.
Our space chips have an extra step to guarantee flawless quality and long life. Our dedicated reliability team performs series of flight model assembly tests according to MIL-STD standards (see detailed list below). Most of these tests are performed within OMMIC and sometimes in external specialized laboratories.
| TEST | TEST CONDITIONS |
|---|---|
| 100% DC & RF | As per datasheet or detail specification |
| BOND PULL * | MIL-STD-883, method 2011 |
| DIE SHEAR * | MIL-STD-883, method 2019 |
| SCANNING ELECTRON MICROSCOPY | MIL-STD-883, method 2018 |
| VISUAL INSPECTION | MIL-STD-883, method 2010 |
| TEST | TEST CONDITIONS |
|---|---|
| BOND PULL * | MIL-STD-883, method 2011 |
| BURN-IN * | MIL-STD-883, method 1015 |
| CONSTANT ACCELERATION * | MIL-STD-883G, method 2001 |
| DIE SHEAR * | MIL-STD-883, method 2019 |
| ELECTRICAL MEASUREMENTS * | No particular method |
| EXTERNAL VISUAL INSPECTION | MIL-STD-883, method 2009 |
| HERMETICITY * | MIL-STD-883, method 1014 |
| HIGH TEMPERATURE STABILISATION | MIL-STD-883, method 1008 |
| MECHANICAL SHOCK * | MIL-STD-883, method 2002 |
| PIND TEST | MIL-STD-883, method 2020 |
| PRE CAP INSPECTION * | MIL-STD-883G, method 2010 |
| TEMPERATURE CYCLING * | MIL-STD-883G, method 1010 |
This test consists of measuring the bonding forces, evaluating the bond strength distributions or determining compliance with the specified strength requirements of the applicable procurement document.
It’s an electrical stress test that typically employs voltage and temperature to accelerate the appearance of latent reliability defects in a device. The objective of burn-in is to eliminate all potential failure likely to occur ate the early phase of the product life time.
This test consists of applying a fixed value acceleration constraint to equipment in order to represent the real environment. It can reveal mechanical and structural weaknesses which would not necessarily be picked up by vibration or mechanical shock tests.
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force and the visual appearance of the residual die attach media and substrate/header metallisation.
The purpose of this test is to confirm that a device meets specific requirements, from the electrical point of view. These measurements are made at different temperatures : -40°C, the room temperature and +85°C.
The purpose of this test is to detect fine and gross leak after sealing of the component in a hermetic package.
It’s a test performed to determine the ability of semiconductor devices to withstand moderately severe shocks resulting from suddenly applied fores or abrupt changes in motion encountered during mishandling, improper transportation, or field operation. Shocks of this type an cause devices to degrade in performance, or to even get damaged permanently.
The purpose of this test is to verify that the assembly of the component conforms to the assembly procedure described in ESCC 20400 method.
It’s a process of cycling though two extremes temperatures, able to detect early-term, latent defects by inducing failure through thermal fatigue.
For customer with higher expectations, we can provide only known good dies. For that, we offer optimal back-end services.
Designed to last for more than 30 years, we provide high performance HEMT & HBT processes using GaN, GaAs and InP technology.
We offer a comprehensive catalogue of MMICs including amplifiers, corechips, frequency converters and diodes from DC to 110 GHz.
Do you want to learn more about OMMIC’s reliability center? Feel free to contact our dedicated support team whenever you need.
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