HIGH-END SPACE INDUSTRY

A SPACE HERITAGE

More than 50 000 MMICs have been supplied for Flight Models. OMMIC has more than 1 000 000 years of accumulated Flight Life time around earth in several space mission and satellite equipment. Components from OMMIC have been used in Flight Models for satellites from Europe, USA, India, Russia and other countries.

Functions include :

  Frequency converters components as mixers and modulators

  Linear components as Low Level Amplifiers

  Control components such as medium Power Amplifiers

  Non linear components such as frequency multipliers

  Negative resistor for oscillators

  Multi-function component as corechip

  Numerical components as phase or frequency detector

We have already delivered many standard parts designed during the ECI (European Component Iniative) programs. OMMIC can be a custom design center for space qualified components, many of them have already been designed by OMMIC’s design team.

WHAT KIND OF FLIGHT MODELS ?

SATCOM

INTERNET EVERYWHERE

EARTH OBSERVATION RADARS

RELIABILITY CENTER

We have a dedicated team for space qualification but also for reliability of all our components. All tests below are assembly test for flight models and are performed at OMMIC or specialised external laboratories.

TEST PERFORMED FOR SPACE EVALUATION

CONSTANT ACCELARATION TEST

The objective of this test is to apply a fixed value acceleration constraint to equipment in order to represent the real environment. Constant acceleration tests can reveal mechanical and structural weaknesses which would not necessarily be picked up by vibration or mechanical shock tests (MIL STD 883G 2001 cond. E, Y1 axis only).

BURN-IN TEST

It’s an electrical stress test that typically employs voltage and temperature to accelerate the appearance of latent reliability defects in a device. The objective of burn-in is to eliminate all potential failure likely to occur ate the early phase of the product life time (MIL STD 883 method 1015).

TEMPERATURE CYCLING TEST

It’s a process of cycling though two temperature extremes, typically at relatively high rates of change. It is an environmental stress test to catch early-term, latent defects by inducing failure through thermal fatigue (MIL STD 883G 1010 cond.C).

MECHANICAL SHOCK TEST

It’s a test performed to determine the ability of semiconductor devices to withstand moderately severe shocks resulting from suddenly applied fores or abrupt changes in motion encountered during mishandling, improper transportation, or field operation. Shocks of this type an cause devices to degrade in performance, or to even get damaged permanently. Shock pulses that are repetitive can also cause damage that is similar to those caused by extreme vibration.

BOND PULL TEST

The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document. This test may be applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected microelectronicdevices bonded by soldering, thermocompression, ultrasonic, or related techniques. (Method Standard MIL STD 883 / ESCC Specification)

DIE SHEAR TEST

The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization. (Method Standard MIL STD 883 / ESCC Specification)

PRE CAP INSPECTION TEST

The purpose of this test is to verify that the assembly of the component conforms to the assembly procedure described in ESCC 20400 method.

ELECTRICAL MEASUREMENTS TEST

The purpose of this test is to confirm that a device meets specific requirements, from the electrical point of view. These measurements are made at different temperatures : -40°C, the room temperature and +85°C.

HERMETICITY TEST

The purpose of this test is to detect fine and gross leak after sealing of the component in a hermetic package.

SPACE QUALIFICATION

OMMIC processes are built for high reliability and space application. This is why, we have been working in collaboration with the European Space Agency (ESA) for more than 20 years. ESA has already evaluated 3 of our processes EDO2AH, D01PH and D01MH which are maintained on the ESA European Preferred Parts List (EPPL). Currently, two additional processes (including the D01GH GaN/Si) are considered to be inserted in the EPPL list after ESA monitored evaluation procedures.