More than 50 000 MMICs have been supplied for Flight Models. OMMIC has more than 1 000 000 years of accumulated Flight Life time around earth in several space mission and satellite equipment. Components from OMMIC have been used in Flight Models for satellites from Europe, USA, India, Russia and other countries.
Functions include :
Frequency converters components as mixers and modulators
Linear components as Low Level Amplifiers
Control components such as medium Power Amplifiers
Non linear components such as frequency multipliers
Negative resistor for oscillators
Multi-function component as corechip
Numerical components as phase or frequency detector
We have already delivered many standard parts designed during the ECI (European Component Iniative) programs. OMMIC can be a custom design center for space qualified components, many of them have already been designed by OMMIC’s design team.
We have a dedicated team for space qualification but also for reliability of all our components. All tests below are assembly test for flight models and are performed at OMMIC or specialised external laboratories.
The objective of this test is to apply a fixed value acceleration constraint to equipment in order to represent the real environment. Constant acceleration tests can reveal mechanical and structural weaknesses which would not necessarily be picked up by vibration or mechanical shock tests (MIL STD 883G 2001 cond. E, Y1 axis only).
It’s an electrical stress test that typically employs voltage and temperature to accelerate the appearance of latent reliability defects in a device. The objective of burn-in is to eliminate all potential failure likely to occur ate the early phase of the product life time (MIL STD 883 method 1015).
It’s a process of cycling though two temperature extremes, typically at relatively high rates of change. It is an environmental stress test to catch early-term, latent defects by inducing failure through thermal fatigue (MIL STD 883G 1010 cond.C).
It’s a test performed to determine the ability of semiconductor devices to withstand moderately severe shocks resulting from suddenly applied fores or abrupt changes in motion encountered during mishandling, improper transportation, or field operation. Shocks of this type an cause devices to degrade in performance, or to even get damaged permanently. Shock pulses that are repetitive can also cause damage that is similar to those caused by extreme vibration.
The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document. This test may be applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected microelectronicdevices bonded by soldering, thermocompression, ultrasonic, or related techniques. (Method Standard MIL STD 883 / ESCC Specification)
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization. (Method Standard MIL STD 883 / ESCC Specification)
The purpose of this test is to verify that the assembly of the component conforms to the assembly procedure described in ESCC 20400 method.
The purpose of this test is to confirm that a device meets specific requirements, from the electrical point of view. These measurements are made at different temperatures : -40°C, the room temperature and +85°C.
The purpose of this test is to detect fine and gross leak after sealing of the component in a hermetic package.
OMMIC processes are built for high reliability and space application. This is why, we have been working in collaboration with the European Space Agency (ESA) for more than 20 years. ESA has already evaluated 3 of our processes EDO2AH, D01PH and D01MH which are maintained on the ESA European Preferred Parts List (EPPL). Currently, two additional processes (including the D01GH GaN/Si) are considered to be inserted in the EPPL list after ESA monitored evaluation procedures.
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